Please take this quick survey to tell us about what happens after you publish a paper. Analog Integrated Circuits and Signal Processing. This paper proposes a new design methodology and new models for power integrity analysis in deep submicron system-on-chip circuit design. The placement plan and interconnect plan are the first design steps, preceding a priori signal and power integrity estimations. The initial power distribution is refined progressively from early mode to final placement and layout. In order to improve accuracy and efficiency in early stage estimates, a multilevel dynamic interconnect model and a fast power distribution model are employed, which consequently result in a drastic reduction of the number of iterations through the design cycle.
Design and Analysis of Power Integrity in Deep Submicron System-on-Chip Circuits
Getting to the bottom of deep submicron - IEEE Conference Publication
Kenny Fourspring. In the world of optoelectronics a common barrier has been integrating logic and device circuits on a single substrate, as it was generally only possible to optimize the device for the logic, or the optoelectronic device at hand. However, a new approach that uses metal organic chemical vapor deposition MOCVD enables the growth of Ill-V semiconductors on silicon substrates. The fact that V semiconductors can now be integrated within the current silicon CMOS processes may allow new possibilities. An approach to investigate the feasibility of this process has been investigated. This method involves the use of oxide trenches to trap defects in a buffer region during crystal growth Figure 1.
Skip to Main Content. A not-for-profit organization, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity. Use of this web site signifies your agreement to the terms and conditions.